专题论坛
| 日期： | 2021年11月3日 |
| 时间： | 08:50-17:00 |
| 地点： | 广州黄埔君澜酒店 |
专题一：IC制造产业生态发展论坛
Session I: IC manufacturing Industrial Eco-development Symposium
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主持人：黄河 博士 中芯集成电路（宁波）有限公司首席执行官 Herb Huang, Ph.D., CEO of Ningbo Semiconductor International Corporation |
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08:30-08:55
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面向智能驾驶的车规级模拟芯片设计 Automotive Grade Analog Circuit Design For Intelligent Driving |
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王云 大湾区集成电路与系统研究院常务副院长/中科院微电子所汽车中心主任 Yun WANG, Executive Vice-president of Guangdong Greater Bay Area Institute of Integrated Circuit and System, Director of R&D Center for Green Energy Automotive Electronics
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08:55-09:20
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复杂智能视觉技术助力半导体制造质量控制 Advanced intelligent vision technology enhances the quality control in semiconductor manufacturing process |
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吴昌力 聚时科技（上海）有限公司研发总监 Changli WU, R&D Director of Matrixtime Robotics Co.,Ltd.
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09:20-09:45
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通过检测及晶圆几何形貌量测实现晶圆及集成电路生产的过程控制 Process Control for Wafer and IC manufacturing through Inspection and Wafer Geometry Metrology |
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屈自豪 博士 科磊半导体设备设备技术（上海）有限公司 Zihao Qu, KLA Corporation
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09:45-10:10
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集成电路制造工艺中的关键参数控制 key parameter control in IC manufacturing process |
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汪志勇 梅特勒-托利多（上海）国际贸易有限公司市场专家 Zhiyong WANG, Marketing Expert of METTLER TOLEDO
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10:10-10:30 |
茶歇与展览交流 Networking Break |
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10:30-10:55
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感知世界 – 先进的3D视觉CIS技术 Sensing the World - Advanced CMOS Image Sensor Technology for 3D Imaging and Beyond |
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秦磊 Tower Semiconductor Ltd. 全球副总裁 Lei QIN, Vice President of China Operations，Tower Semiconductor Ltd.
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10:55-11:20
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晶圆车间物料配送自动化解决方案-移动操作机器人的应用 Wafer workshop material distribution automation solution-Application of Autonomous Mobile Robot |
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邓栋梁 深圳优艾智合机器人有限公司 营销总监 Alan Deng, Marketing Director of Shenzhen Youibot Robotics Co.,Ltd.
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11:20-11:45
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智能化错误侦测与分类系统在半导体制造中的数据分析应用 The data analysis application in Semiconductor Manufacturing by Intelligent Fault Detection & Classification (iFDC) |
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师伟堂 上海哥瑞利软件股份有限公司产品总监 Weitang Shi, Product Director of Shanghai Glorysoft Co., Ltd.
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11:45-12:10
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为芯片筑建家园 Building Home FOr CHIPS |
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王丙信 中国电子系统工程第二建设有限公司高级副总经理 Bingxin Wang, Senior Vice President of China Electronics System Engineering No.2 Construction Co., Ltd.
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12:10-12:15 |
幸运抽奖 Lucky Draw |
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12:15-13:30 |
自助午餐 Buffet Lunch |
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主持人：徐伟 广东芯粤能半导体有限公司总经理 Moderator: Wei XU, General Manager of AscenPower Semiconductors Co., Ltd.
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13:30-13:55
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三维晶圆级先进封装技术进展 Progress of 3D Wafer level advanced packaging technology |
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马书英 华天科技(昆山)电子有限公司研究院院长 Dennies Ma, Huatian Technology (Kunshan) Electronics Co., Ltd.
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13:55-14:20
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武汉新芯先进特色工艺的发展与创新 The Development and Innovation of XMC’s Advanced Specialty Technologies |
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袁忠根 武汉新芯集成电路制造有限公司代工业务处市场总监 Tom Yuan, XMC
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14:20-14:45
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New Data Analytics Approach for Advanced Semiconductor IC Manufacturing 先进半导体 IC 制造的新型数据分析方法 |
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黄钦州 科磊半导体设备设备技术（上海）有限公司产品营销总监 Kevin Huang, Director of Product Marketing in KLA Corporation
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14:45-15:05 |
茶歇与展览交流 Networking Break |
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15:05-15:30
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ASM赋能先进技术 ASM enable advanced technologies |
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徐来 ASM中国区总经理 LAI XU, General Manager of ASM China, Inc.
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15:30-15:55
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本土IC制造生态：有机成长回顾与对比浅析 Domestic IC Manufacturing Ecosystem: Historical and Comparative Review and Analysis on Organic Growth |
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黄河 博士 中芯集成电路（宁波）有限公司首席执行官 Herb Huang, Ph.D., CEO of Ningbo Semiconductor International Corporation
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15:55-16:20
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行业持续景气，国产设备材料厂商进入黄金发展期 The Industry Continues To Prosper, Domestic Equipment & Material Manufacturers Have Entered A Golden Period of Development |
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李双亮 兴业证券经济与金融研究院电子行业资深分析师 ShuangLiang Li, Electronics Industry Senior Analyst, Research Institute of Economics and Finance, China Industrial Securities.
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16:20-16:45
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芯片制程关键材料开发，助力半导体产业生态发展 Development of key materials for the chip manufacturing process to promote the ecological development of the semiconductor industry |
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刘志斌 博士 广东粤港澳大湾区黄埔材料研究院芯片化学材料中心执行副主任，高级工程师 Zhibin Liu, Director/Senior Engineer of Executive Deputy Director of Chip Chemical Materials Center, HUANGPU INSTITUTE OF MATERIALS
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16:45-16:55 |
幸运抽奖 Lucky Draw |
实际议程以当天为准
专题二：智能传感器专题论坛
Session II: Intelligent Sensor Symposium
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智能传感器主论坛 Main Forum Of Intelligent Sensor Symposium |
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主持人：杨潇 国家智能传感器创新中心董事长 Moderator: Xiao YANG, Chairman of National Intelligent Sensor Innovation Center |
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09:00-09:30 |
会议签到 Sign in |
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09:30-09:45 |
致辞——工信部领导、广东省领导 Addresses——Leader from the Ministry of Industry and Information Technology、Leader from Guangdong Province
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09:45-10:10 |
粤港澳大湾区集成电路及传感器产业建设的历史机遇 Historical Opportunities For The Construction Of Integrated Circuit And Sensor Industry In Great Bay Area |
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于洪宇 南方科技大学深港微电子学院院长 Hongyu YU, Dean of Shenzhen Hong Kong School of microelectronics, Southern University of science and technology
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10:10-10:35
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上海工研院公共研发中试平台打破超越摩尔领域技术转移壁垒 SITRI‘s open R&D platform breaks down barriers to technology transfer in the field of More than Moore |
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丁辉文 上海微技术工业研究院总经理 Mark Ding, SITRI CEO
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10:35-11:00
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先进传感器产业生态建设 Ecological construction of advanced sensor industry |
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张文燕 国家智能传感器创新中心 副总裁 Wenyan Zhang, Vice-president of National Intelligent Sensor Innovation Center
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11:00-11:25
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消费类传感器技术发展方向 Development Direction of Consumer Sensor Technology |
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潘政民 瑞声科技控股有限公司行政总裁兼执行董事 Zhengmin PAN, CEO and Executive director of AAC Technologies
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11:25-11:50
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MEMS滤波器的研发与产业化 R&D and Industrialization of MEMS filters |
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杨云春 北京赛微电子股份有限公司董事长 Yunchun Yang, Chairman of Sai MicroElectronics Inc.
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11:50-12:15
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智能传感器的IDM模式 IDM model for Smart Sensors |
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张宾 广州奥松电子股份有限公司 董事长 Bin Zhang, Chairman of Aosong Electronic Co., LTD
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12:15-14:00 |
自助午餐 Buffet Lunch |
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传感器应用论坛 Sensor Application Forum |
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主持人：丁辉文 上海微技术工业研究院总经理 Mark Ding, SITRI CEO |
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14:00-14:25
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中国MEMS-IDM发展之路 The Road of Development of Chinese MEMS-IDM |
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胡铁刚 杭州士兰微电子股份有限公司副总经理 Tiger Hu，The Vice President of SILAN Microelectronics Co. , LTD
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14:25-14:50
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全屋智能时代智能传感器的机遇与挑战 Opportunity and Challenges of Smart Sensor in the Era of Smart Home |
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马建良 美的集团中央研究院感知技术研究所所长 Jalen Ma, Director of Intelligent Perception Institute Midea Corporate Research Center
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14:50-15:15
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医用传感器应用及趋势 Application and Trend of Medical Transducers |
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岑建 迈瑞医疗生命信息与支持事业部总经理， Jian Cen, General Manager, Patient Monitoring and Life Support Division, Mindray.
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15:15-15:30 |
茶歇与展览交流 Networking Break |
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15:30-15:55
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车规级传感器应用 The sensor application for automotive level |
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方骏 上海矽睿科技副总裁 Fang jun, shanghai QST VP
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15:55-16:20
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CMOS-MEMS 智能微流控及其应用 CMOS-MEMS Microfluidics and Its Applications |
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关一民 上海傲睿科技有限公司董事长 Yimin GUAN, Chairman and CEO, Shanghai Aurefluiics Technology
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实际议程以当天为准
专题三：第四届中国半导体材料创新发展大会
Session III: The 4th China Semiconductor Materials Innovation and Development Conference
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09:00-09:25
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IC材料奖颁奖礼 IC Award Ceremony |
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主持人：石瑛 ICMtia常务副理事长兼秘书长 Host: Ying Shi, Executive Vice Chairman &Secretary General，ICMtia
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主旨报告 Keynote Speech |
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主持人：王淑敏 博士 安集微电子科技（上海）股份有限公司董事长兼总经理 & 姚力军 博士 宁波江丰电子材料股份有限公司董事长兼首席技术官 Host: Dr. Shuming Wang, Chairman and General Manager, Anji Microelectronics Technology（Shanghai）Co., Ltd. & Dr. Lijun Yao, Chairman and Chief Technology Officer, Konfoong Materials International Co., Ltd.
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09:30-09:50
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先进封装与其材料的要求 Advanced Packaging and Its Material Requirements |
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郑子企 博士 通富微电子股份有限公司先进封装CTO Dr. Key. Chung, Advanced Package CTO, TongFu Microelectronics Co., Ltd
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09:50-10:10
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技术大融合时代 – 重塑半导体和电子科技发展格局 Reinventing Electronics in the Era of Disruptive Convergence |
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安高博 默克中国总裁|默克电子科技中国区董事总经理 Allan Gabor, President, Merck China, Managing Director of Electronics China
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10:10-10:30
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集成电路用电子气体的现状和发展预期 Current Status and Development Expectation of Electronic Gas Used in Integrated Circuits |
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李俊华 博士 中船重工(邯郸)派瑞特种气体有限公司董事长 Dr. Junhua Li, Chairman, PERIC Special Gases Co., Ltd
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10:30-10:50
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CMP的艺术，纳米界面的材料工程科学原理 Art of CMP, Scientific Principles of Materials Engineering at the Nano Scale Interface |
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王雨春 博士 安集微电子科技（上海）股份有限公司副总裁 Dr. Yuchun Wang, Vice President, Anji Microelectronics Technology（Shanghai）Co., Ltd.
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10:50-11:10
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ArF光刻胶产品开发和产业化进展 ArF Photoresist Product Development and Industrialization Progress |
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毛智彪 博士 宁波南大光电材料有限公司副总经理 Dr. Zhibiao Mao, Vice President, Ningbo Nata Opto-Electronic Materials Co., Ltd
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11:10-11:30
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半导体材料市场的发展前景、挑战和新兴机遇 Semiconductor Materials Outlook, Challenges, and Emerging Opportunities |
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Dan P. Tracy博士 TECHCET高级市场分析师 Dr. Dan P. Tracy, Sr. Director and Sr. Market Analyst, TECHCET
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11:30-11:50
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中国集成电路制造材料产业现状及发展态势 The Status and Development Tendency of China IC Manufacturing Material Industry |
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石瑛 ICMtia常务副理事长兼秘书长 Ying Shi, Executive Vice Chairman & Secretary General, ICMtia
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12:00-13:00 |
自助午餐 Buffet Lunch |
实际议程以当天为准
专题四：IC设计与制造协同
Session V: Synergetic Development of IC Design and Manufacturing
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主持人：俞少峰 复旦大学微电子学院教授 Moderator: Shaofeng YU, Professor of School of Microelectronics, Fudan University，Shanghai, China |
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09:00-09:10
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致辞——张卫 复旦大学微电子学院院长 Address—— Wei ZHANG, Dean of School of Microelectronics, Fudan University，Shanghai, China
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09:10-09:30
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半导体先进制造技术2.0 Next generation advanced semiconductor manufacturing technology |
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魏琦 紫光展锐产品工程部部长 QI.WEI, Director of Product enginneering department, UNISOC.
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09:30-09:50
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Calibre机器学习平台助力芯片智能制造 Calibre machine learning platform enabling IC Smart Manufacturing |
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李智峰 西门子EDA应用工程经理 Zhifeng Li, AE Manager，Siemens EDA
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09:50-10:10
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Silvaco TCAD 助力半导体制造和设计协同 |
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常志强 Silvaco 中国TCAD技术支持经理 Kevin Chang, TCAD Manager Silvaco China
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10:10-10:30 |
茶歇与展览交流 Networking Break |
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10:30-10:50
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成熟领先IP帮助国产处理器从芯片走向解决方案 Proven leading IP enable domestic processors move from chips to solutions |
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时昕 博士 Imagination中国区战略市场及生态副总 Dr. Tim Shi, Imagination Technology
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10:50-11:10
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集成电路设计工艺协同优化流程和工具 DTCO work flow and EDA tools |
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伍宏 墨研计算科学有限公司总经理 Hong Wu, CEO of Moyan Computational Science Co., Ltd.
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11:10-11:30
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后摩尔时代设计与制造的融合发展 Integrative development of design and manufacturing in the post-Moor era |
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沈磊 中国半导体行业协会集成电路设计分会副理事长、上海市集成电路行业协会副会长、复旦大学研究生导师、上海复旦微电子集团股份有限公司总工程师 Shen Lei, Vice Chairman of China Semiconductor Industry Association IC Design Branch, Vice President of Shanghai IC Industry Association, Graduate Tutor of Fudan University, Chief Engineer of Shanghai Fudan Microelectronics Group Company Limited.
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11:30-11:50
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落地DTCO，助力中国半导体产业 From Data to Design Signoff: An EDA Eco-system for DTCO enablement |
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刘文超 概伦电子股份有限公司副总裁 Wenchao LIU, VP of Primarius Technologies Co., Ltd
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11:50-13:30 |
自助午餐 Buffet Lunch |
实际议程以当天为准
专题五：集成电路质量保障和提升
Session VI: IC Quality Assurance and Improvement
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主持人：王小强 工业和信息化部电子第五研究所元器件检测中心副主任 Moderator: Mr. Xiaoqiang Wang，Vice-Director of the Test Center of Electronic Components of China Electronic Product Reliability and Environmental Test Research Institute |
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09:00-09:05 |
领导致辞 Opening Ceremony |
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工信部科技司/电子司领导 Leadership Speech
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主题演讲 Keynote Speech
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09:05-09:25
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《国产化替代整体解决方案助推集成电路高质量发展》 《High-Quality Development of Integrated Circuits by Total Solution for Domestic》 |
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罗道军 工业和信息化部电子第五研究所元器件检测中心主任 Daojun Luo, Director of the Test Center of Electronic Components of China Electronic Product Reliability and Environmental Test Research Institute.
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09:25-09:45
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《产品全生命周期质量管控》 《Quality Control of the Life Cycle of Products》 |
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沈磊 中国半导体行业协会集成电路设计分会副理事长、上海市集成电路行业协会副会长、复旦大学研究生导师、上海复旦微电子集团股份有限公司总工程师 Shen Lei, Vice Chairman of China Semiconductor Industry Association IC Design Branch, Vice President of Shanghai IC Industry Association, Graduate Tutor of Fudan University, Chief Engineer of Shanghai Fudan Microelectronics Group Company Limited.
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09:45-10:05
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《加强企业质量基础设施（EQI）建设，支撑我国电力集成电路产业高质量发展》 《Strengthen the construction of enterprise quality infrastructure to support the high-quality development of China's IC industry 》 |
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王东山 国网信通产业集团北京智芯微电子科技有限公司资深技术专家 Dongshan Wang, Senior Technology Expert of the State Grid Communications Industry Group Beijing Smart Chip Microelectronics Technology Co., Ltd.
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10:05-10:20
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茶歇&抽奖环节 Tea Break& Lottery Activity
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10:20-10:40
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《用“芯”管理，质量长存》 《Managing With Heart, for Lasting Memory》 |
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何谊 长江存储科技有限责任公司副总裁 Dr. Yi He, Vice President of Yangtze Memory Technologies Co., Ltd
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10:40-11:00
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《功率半导体质量与可靠性》 《Quality and Reliability of Power Semiconductor Devices》 |
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任亚东 株洲中车时代半导体有限公司 研发中心主任助理 Yadong Ren, Assistant director of R & D Center of CRRC ELECTRIC VEHICLE Co., Ltd
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11:00-11:20
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《国产光耦芯片质量提升及高端光耦芯片国产替代》 《The Operation Quality of Optocoupler in China and Domestic Replacement of High-end Optocoupler Chip》 |
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陈益群 宁波群芯微电子有限责任公司执行董事兼总经理 Yiqun Chen, Executive Director and General Manager of NingBoQunXin Microelectronics Co., Ltd
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11:20-12:00 |
圆桌论坛——从“芯”出发，国产集成电路自主自强之路 Roundtable Forum——Self-reliance and Self-improvement in Integrated Circuits
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主持人：罗道军 工业和信息化部电子第五研究所元器件检测中心主任 Host: Mr. Daojun Luo, Director of the Test Center of Electronic Components of China Electronic Product Reliability and Environmental Test Research Institute. 圆桌嘉宾（拟）： guests: 张 宾 广州奥松电子有限公司董事长 Mr. Bin Zhang, Chairman of Guangzhou Ausong Electronic Co., Ltd 刘 凯 美的集团美仁半导体公司总经理 Mr. Kai Liu, General Manager of MR SEMI Co., Ltd 蔡述庭 广东工业大学微电子学院副院长 Dr.Tingshu Cai，Deputy Head the School of Microelectronics of Guangdong University of Technology 赵 斌 粤芯技术市场副总裁 Mr. Bin Zhao, VP of technology market of CANSEMI Technology Co., Ltd 熊振武 珠海全志科技股份有限公司质量总监 Mr. Zhenwu Xiong, Quality Director of Allwinner Technology Co., Ltd 刘 雄 深圳市紫光同创电子有限公司质量总监 Mr. Xiong Liu, Quality Director of SHENZHEN PANGO MICROSYSTEMS CO.,LTD.
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12:00-13:30 |
自助午餐 Buffet Lunch |
实际议程以当天为准
专题六：装备与零部件创新论坛
Session VII: Equipment and Parts Innovation Forum
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2021年11月1日 星期一 13:30-17:30 广州黄埔君澜酒店 Nov. 1st, 2021 Monday 13:30-17:30 NARADA Hotel, Guangzhou |
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14:15-14:30
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来宾入场签到 Sign in
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主持人：张国铭 中国集成电路装备创新联盟秘书长、华海清科股份有限公司总经理 Moderator: Guoming ZHANG, Secretary-General of China IC Equipment Industry Innovation Strategic Alliance , President fo Hwatsing Technology co.,Ltd |
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14:30-15:10 |
致词讲话 Addresses |
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1、 雷震霖 中国集成电路零部件创新联盟理事长 Zhenlin LEI, President of IC Components Inovation Alliance 2、 赵晋荣 中国集成电路装备创新联盟理事长、北方华创科技集团股份有限公司董事长 Jinrong ZHAO, President of IC Equipment Industry Innovation Strategic Alliance, Chairman of NAURA Technology Group Co., Ltd 3、 叶甜春 02专项技术总师、中国集成电路创新联盟副理事长兼秘书长 Tianchun YE, President of Academy of Integrated circuit, Chinese Academy of Sciences; Head of Overall Panel of National Science and Technology Major Projects (02)；Vice President of China Semiconductor Industry Association 4、 部委领导 Related Leader
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15:10-15:30 |
茶歇&合照 Networking Break |
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专题报告 Keynote Speech |
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15:30-15:50 |
题目待定 To be Decided |
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康劲 博士 北方集成电路技术创新中心(北京)有限公司总经理、芯链融创集成电路产业发展(北京)有限公司董事长 Dr. Jin KANG, General Manager of STIC
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15:50-16:10
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关于发展我国半导体装备与零部件产业的思考 Reflections on Developing China's Semiconductor Equipment and Parts Industry |
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赵晋荣 中国集成电路装备创新联盟理事长、北方华创科技集团股份有限公司董事长 Jinrong ZHAO, President of IC Equipment Industry Innovation Strategic Alliance, Chairman of NAURA Technology Group Co., Ltd
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16:10-16:30
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打造高质量的、有国际竞争力的半导体设备公司 Developing High Quality and Globally Competitive Semiconductor EquipmenEnterprise |
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尹志尧 中国集成电路装备创新联盟副理事长、中微半导体(上海）股份有限公司董事长兼首席执行官 Gerald YIN, Vice-president of IC Equipment Industry Innovation Strategic Alliance ，Chairman and CEO of Advanced Micro-Fabrication Equipment Inc. China (AMEC)
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16:30-16:50 |
题目待定 To be Decided |
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郑广文 中国集成电路零部件创新联盟副理事长兼秘书长、沈阳富创精密设备股份有限公司董事长 Guangwen ZHENG, Vice president and Secretary General of IC Components Inovation Alliance & Chairman of Shenyang Fortune PRECISION Equipment Co., Ltd.
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16:50-17:00 |
总结讲话Concluding Remarks |
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18:00-20:30 |
晚宴-装备与零部件联盟全体参会人员 Membership Dinner-Equipment And Components Innovation Alliance |
实际议程以当天为准
专题七：检测与测试创新论坛
Session VIII: Measurement and Testing Alliance Forum
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论坛主题： 芯测试 新挑战 “测”马扬鞭 开启检测新征程 Theme: New Challenge, New Journey |
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14:00-14:20 |
领导致词 Addresses |
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叶甜春 中国半导体行业协会集成电路分会理事长、国家科技重大专项02专项技术总师、中国集成电路创新联盟副理事长兼秘书长 Tianchun YE, President of Academy of Integrated circuit, Chinese Academy of Sciences; Head of Overall Panel of National Science and Technology Major Projects (02)；Vice President of China Semiconductor Industry Association
雷瑾亮 检测&测试联盟副理事长/02 专项总体专家组 Jinliang LEI, Vice chairman of China IC Inspection and Testing Alliance/02 Project Expert
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14:20-14:35 |
集成电路检测和测试技术产品白皮书发布 Integrated Circuit Inspection And Test Technology Product White Paper Release |
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孙鹏 检测&测试联盟副秘书长 Peng SUN, Under Secretary General Of China IC Inspection and Testing Alliance
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14:35-14:55 |
茶歇与展览交流 Networking Break |
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论坛主旨报告 Keynote Speech |
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主持人：陆坚 中国电科第58所检测事业部总经理、检测&测试联盟副秘书长 Moerator: Jian LU, General Manager Of The 58th Research Institute Of China Electronics Technology Corporation & Secretary General Of China IC Inspection and Testing Alliance |
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14:55-15:20
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中国集成电路测试业发展展望 China IC Test industry has bright future |
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肖志强 中国电科第58所副所长 Zhiqiang Xiao, Deputy director of the 58th Research Institute of China Electronics Technology Corporation
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15:20-15:45
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高精度ADC测试技术 Test Techniques of High-precision ADC |
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戴志坚 电子科技大学高等研究院集成电路测试技术实验室主任 Zhijian Dai，IC Test Lab director of Higher Research Institute（shenzhen） of University of Electronic Science and technology of China
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15:45-16:10
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射频测试技术的演变、落地和未来 Evolution, localization and future of RF testing technology |
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唐亮 砺铸智能设备（天津）有限公司总经理、唐明盛试科技（嘉善）有限公司董事长 Liang Tang, CEO of MIT Semiconductor (Tianjin) Co., Ltd., Chairman of TMSS Technology (Jiashan) Co., Ltd.
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16:10-16:35
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CPU的测试挑战及应对策略 The Challenge of CPU Benchmark and Coping Strategy |
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郭御风 飞腾公司副总经理、南开大学教授 Yufeng Guo, Vice President of Phytium Information Technology Co. LTD., Professor and Researcher at NanKai University
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16:35-17:00
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宽波段等离子光学晶圆检测对缺陷发现及监控的应用 Broadband Plasma Optical Wafer Inspection for DefDiscovery and Monitoring |
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华波 美国KLA公司产品市场经理 Bo HUA, Product Marketing Manager in KLA
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实际议程以当天为准
专题八：功率及化合物半导体论坛
Session IX: Power & Compound Semiconductor Development Symposium
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主持人：周贞宏 博士 福建省安芯投资管理有限责任公司管理合伙人兼首席战略官 Moderator: Zhenhong ZHOU, Managing Partner & Chief Strategy Officer, An Xin Capital Co. Ltd |
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时间/Time |
演讲题目/Topic & 演讲人/Speaker |
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09:00-09:25
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SiC功率模块在新能源汽车中的应用 The Application of SiC Power Modules in Electric Vehicles |
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周晓阳 广东芯聚能半导体有限公司CEO Gilbert ZHOU, CEO of Guangdong AccoPower Semiconductor Co.,Ltd.
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09:25-09:50
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低碳“芯“机遇——碳化硅功率器件技术和应用 The Technology and Application of SiC Power Device |
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汪之涵 深圳基本半导体有限公司董事长 Zhihan Wang, Chairman of BASiC Semiconductor LTD.
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09:50-10:15
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舜宇仪器智能光学检测及技术展望 SOPTOP Intelligent Optical Inspection and Technology Prospect |
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李涛 宁波舜宇仪器有限公司研发总监 James Li, R & D Director of Ningbo Sunny Instruments Co., Ltd.
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10:15-10:35 |
茶歇与展览交流 Networking Break |
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10:35-11:00
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面向快充应用的GaN材料和器件技术 Gan Materials and device technology for PD quick charger applications |
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袁理 青岛聚能创芯微电子有限公司总经理 Li Yuan，General Manager of Qingdao Cohenius Microelectronics Co.,Ltd.
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11:00-11:25
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第三代化合物半导体CIM/MES解决方案 CIM/MES Solution for the Third-generation Semiconductor |
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梁惠生 上扬软件(上海)有限公司技术总监 Huisheng LIANG, Technical Director, FA Software (Shanghai) Co., Ltd.
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11:25-11:50
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利用结构创新赋能本土半导体产业链升级 Creating Values for China Semiconductor supply chain through innovation in workflow, infrastructure, and digital solutions |
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曹潇潇 赛默飞世尔科技高级业务拓展经理 Xiaoxiao Cao, Senior Manager for Business Development, Material Structure Division, Thermo Fisher Scientific
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11:50-11:55 |
幸运抽奖 Lucky Draw |
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11:55-13:30 |
自助午餐 Buffet Lunch |
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主持人：周晓阳 广东芯聚能半导体有限公司CEO Moderator: Gilbert ZHOU, CEO of Guangdong AccoPower Semiconductor Co.,Ltd.
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13:30-13:55
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SiC功率器件的技术发展，机遇与挑战 The development, opportunities and challenges of SiC power devices |
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邓旻熙 华润微电子有限公司 功率器件事业群高级经理 Minxi Deng, Senior Manager of China Resources Microelectronics Limited. PDBG
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13:55-14:20
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化合物半导体工艺设备解决方案 Equipment and Process Solutions in Compound Semiconductor |
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牛群 北京北方华创微电子装备有限公司华南区办事处总经理 Qun Niu, General Manager of South China Office Beijing NAURA Microelectronics Equipment Co., Ltd.
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14:20-14:45
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原子层沉积技术在GaN功率半导体制造中的创新应用 Atomic Layer Deposition Enabling Innovation in GaN Power Semiconductor Manufacturing |
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聂翔 青岛四方思锐智能技术有限公司总经理 Xiang NIE, General Manager, Qingdao Sifang SRI Intellectual Technology Co.Ltd
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14:45-15:05 |
茶歇与展览交流 Networking Break |
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15:05-15:30
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碳化硅在新能源汽车领域的应用及市场前景 Application and market prospects of silicon carbide in new energy vehicles |
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陈东坡 北京三安光电有限公司副总经理 Dongpo Chen, Deputy General Manager of Beijing Sanan Optoelectronics Co., Ltd.
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15:30-15:55
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国产碳化硅突破的难点与机遇 Challenges and Opportunities of China Silicon Carbide Industry |
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高远 泰科天润半导体技术(北京)有限公司应用测试中心主任 Gao Yuan, Director of Application and Testing Center of Global Power Technology Co., Ltd., Inc.
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15:55-16:20
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功率器件先进微纳金属烧结封装技术 Advanced Micro-Nano Metallic Sintering Technology in Power Electronics Packaging |
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李俊 深南电路股份有限公司 研发总监/深圳第三代半导体研究院 技术专家，项目负责人 Jun LI, Technical Expert, Shennan Circuit Co., Ltd./ Shenzhen Institute of Wide-Bandgap Semiconductors
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16:20-16:45
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中国第三代半导体产业乘风破浪，扬帆起航 The advanced semiconductor industry in China, which braves waves and sail forward with resolve |
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朱航欧 爱集微咨询（厦门）有限公司集成电路产业高级分析师 Hangou Zhu, Senior Analyst of JW Insights (Xiamen) Co., Ltd.
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16:45-16:55 |
幸运抽奖 Lucky Draw |
实际议程以当天为准
专题九: 半导体投资合作论坛
Session X: Semiconductor Investment & Cooperation Symposium
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主持人：Polly Peng博士 华登国际 董事总经理 Moderator: Dr. Polly Peng, MD & Partner of Walden Internationalcky Draw |
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13:30-13:50 |
开场致词Opening address 特邀嘉宾致词Invited address |
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金圣宏 粤财控股 董事长 Jin Shenghong, Chairman of Utrust Group 卢一先 广州市委常委、南沙区委书记 Lu Yixian, Official of Guangzhou, Nansha District Party Secretary
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13:50-14:10
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历史的机会，高科技的春天 Historic Opportunity, High Tech Spring is coming |
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黄庆 华登国际 董事总经理、中国半导体行业协会IC设计分会副理事长 Hing Wong, MD of Walden International, Vice General Director of CSIA-ICCAD
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14:10-14:40
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半导体产业链投资热点 IC Industry Chain Investment hotspot |
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王新潮 中国半导体行业协会封测分会名誉理事长、国家封测产业链技术创新战略联盟理事长 Wang Xinchao, Honorary General Director of CSIA-Packaging & Testing Branch, General Director of China Packaging & Testing Industry Chain Technology Innovation Strategy Alliance
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14:40-15:10
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全球产能分布和扩产计划及趋势 Global Capacity Distribution and Production Expansion Plan and Trend |
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盛陵海 Gartner 副总裁 Roger Sheng, VP of Gartner
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15:10-15:30 |
茶歇与展览交流 Networking Break |
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15:30-16:30 |
圆桌A：“缺芯时代”半导体制造业投资探讨 Panel A: In Lack of IC Era, Semiconductor Manufacturing Industry Investment Discussion
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主持人：黄 庆 华登国际 董事总经理Moderator: Hing Wong, MD of Walden International 嘉宾（排名不分先后）Guests(in no particular order) 尹志尧 中微公司 董事长兼总裁Gerald Yin, Chairman of AMEC 王海滨 广州国发 董事长 Wang Haibin, Chairman of GOFAR 杜 洋 芯鑫租赁 董事长兼总裁Du Yang, Chairman & CEO of Sino-IC Leasing 袁 锋 广汽资本 总经理 Yuan Feng, GM of GAC-Capital 孙玉望 中芯聚源 总裁 Sun Yuwang, CEO of China Fortune-Tech Capital 陈 伟 矽力杰半导体 董事长Issac Chen, Chairman of Silergy
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16:30-16:45
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半导体设备材料投资数据分析 Investment Analysis Report of China Semiconductor equipment and materials |
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赵占祥 云岫资本合伙人兼CTO Adam Zhao, Partner & CTO of Winsoul Capital
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16:45-17:45 |
圆桌B：深耕广东，共同打造半导体产业第三极 Panel B: Deeply Root in Guangdong, Co-Building Semiconductor Industry Third Pole
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主持人：王林 华登国际 合伙人Moderator: Wang Lin, Parner of Walden International 嘉宾（排名不分先后）Guests(in no particular order) 居 龙 SEMI 中国区总裁Lung Chu, China President of SEMI 李海明 粤芯半导体 市场副总裁Haiming Chen , Vice President of CanSemi Tech 张 琤 光控母基金 董事总经理Zhang Cheng, MD of Everbright FOF 熊 泉 武岳峰科创 合伙人Peter Xiong, Partner of SummitView Capital 王淑敏 安集科技 董事长兼总经理 Wang Shumin, Chairman & CEO of Anji Micro 胡胜发 安凯微电子 董事长 Norman Hu, Chairman & CEO of AnyKa
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18:00-20:00 |
晚餐（仅限受邀参加）Dinner(Invited only) |
实际议程以当天为准
专题十: 汽车芯片应用牵引创新发展论坛
Automotive chip application traction innovation and development Symposium
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主持人：任艳 工业和信息化部电子第五研究所元器件与材料研究部副主任 Moderator: Yan Ren, Deputy Director of Components and Materials Research Department, The Fifth Institute of Electronics, Ministry of Industry and Information Technology of the People’s Republic of China
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08:30-08:40 |
签到 Sign in |
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08:40-08:45 |
开场致辞 Opening address——Xiaojie Qu, Deputy director of Department of industry and information technology of Guangdong Province
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08:45-09:05
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车载芯片的应用现状与发展趋势 Application Status and Development Trend of the Automobile Chip |
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张进 广州汽车集团股份有限公司汽车工程研究院副院长 Zhang Jin, GAC Automotive Research & Development Center Vice President
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09:05-09:25
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智联万物，自万协通5G超级eSIM芯开始 Zhilian everything From WST 5g super ESIM core |
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王礼宇 广州万协通信息技术有限公司总经理 Liyu WANG, General manager of WISESECURITY TECHNOLOGY (GUANGZHOU) CO.,LTD
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09:25-09:45
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汽车电子产业的国产化芯片应用 Application of domestic chip in Chinese automotive electronics industry |
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陈鑫 惠州市德赛西威汽车电子智能座舱事业单元副总经理 Xin Chen, Executive Vice General Manager of Huizhou Desay SV Automotive Co., Ltd. BU Instrument Cluster & Infotainment
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09:45-10:05
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模拟芯片在新能源汽车的应用 Application of Analog IC in NEVs |
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陈伟 矽力杰股份有限公司 董事长 Wei Chen, Chairman of Silergy Co., Ltd
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10:05-10:20 |
茶歇与展览交流 Networking Break |
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10:20-10:40
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新能源汽车功率半导体技术及其进展 Automobile Power Semiconductor Technology and Progress |
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刘国友 株洲中车时代电气股份有限公司新型功率半导体器件国家重点实验室常务副主任，中车科学家 Guoyou Liu, CRRC Scientist, Executive deputy director for State Key Laboratory of Advanced Power Semiconductor Devices
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10:40-11:00
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汽车芯片国产替代与质量提升技术 Localized Substitution and Quality Improvement Technology of Automotive Chips |
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路国光 工业和信息化部电子第五研究所国家重点实验室副主任 Guoguang Lu, Deputy Director of the State Key Laboratory, The Fifth Institute of Electronics, Ministry of Industry and Information Technology of the People’s Republic of China
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11:00-11:20
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中国汽车芯片产业的机遇挑战与应对策略 Opportunity，Challenge and Strategy of China Automotive Chips Industry |
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邹广才 中国汽车芯片产业创新战略联盟副秘书长 Guangcai Zou, Vice Secretary General of China Automotive Chips Industry Innovation Alliance
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11:20-12:00 |
圆桌：汽车芯片应用牵引探讨 Panel : Automotive Chip Application Traction Discussion |
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主持人：任艳 工业和信息化部电子第五研究所元器件与材料研究部副主任 Moderator: Yan Ren, Deputy Director of Components and Materials Research Department, The Fifth Institute of Electronics, Ministry of Industry and Information Technology of the People’s Republic of China 嘉宾（排名不分先后）Guests(in no particular order) 韦德领 东风日产乘用车公司技术中心副中心长 Deling Wei, Deputy Center Director of Dongfeng Nissan Passenger Vehicle Company Technology Center 陈 卓 惠州华阳通用电子有限公司首席技术官 Steven, Chief Technology Officer of Huizhou Foryou General Elections Co., Ltd 周晓阳 广东芯聚能半导体有限公司总裁 Gilbert, Chief Executive Officer of Guang Dong Accopower Semiconductor Co., Ltd 邹广才 中国汽车芯片产业创新战略联盟副秘书长 Guangcai Zou, Vice Secretary General of China Automotive Chips Industry Innovation Alliance 刘国友 株洲中车时代电气股份有限公司新型功率半导体器件国家重点实验室 常务副主任，中车科学家 Guoyou Liu, Executive Deputy Director & CRRC Scientist for State Key Laboratory of Advanced Power Semiconductor Devices of Zhuzhou CRRC Times Electric Co., Ltd 沈 宁 中国人民财产保险股份有限公司广东省分公司 副总经理 Ning Shen, Vice General Manager of PICC Property and Casualty Company Limited of Guangdong Branch 叶建斐 深圳中电港技术股份有限公司 副总经理 Antonio, Vice General Manager of China Electronics Corporation Port technology Co., Ltd
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12:00-12:05 |
幸运抽奖 Lucky Draw |
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12:05-13:00 |
午餐（仅限受邀参加）Lunch(Invited only) |
实际议程以当天为准
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