高峰论坛
2023-08-18 作者: system
| 高峰论坛 | |
| Summit Forum | |
| 时间：8月10日 09:00-17:40 地点：A6馆A区 | |
| Time:09:00-17:40 August 10th Venue: Hall A6 | |
| 赞助单位：北方华创、盛美、芯鑫租赁、中科飞测、拓荆、中微、先导、邑文、睿励、微导、鲁汶仪器、思锐智能、聚时科技、苏州芯睿、微崇、摩尔精英 | |
| 主持人：王晖 博士 中国电子专用设备工业协会半导体设备分会理事长、盛美半导体设备（上海）股份有限公司董事长 | |
| Moderator:David Wang,Chairman of ACM Research (Shanghai), Inc. | |
| 开幕式 Opening Ceremony | |
| 时间/Time | 内容/Contents |
09:00-09:10 |
领导致辞 Welcome Speech |
09:10-09:20 |
高新区集成电路产业高质量发展政策兑现仪式 |
| 无锡市新吴区人民政府 | |
09:20-09:40 |
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| 李虹 博士 华润微电子有限公司执行董事、总裁 | |
| David Li,CEO of China Resources Microelectronics Limited Company | |
09:40-10:10 |
集成电路设备产业发展的现状和挑战，人类第三次工业革命的到来 |
| Semiconductor Equipment Market Trend，Challenge and the Third Industry Revolution | |
| 尹志尧 博士 中微半导体设备(上海）股份有限公司董事长兼总经理 | |
| GERALD YIN,CHAIRMAN&CEO of AMEC | |
10:10-10:30 |
茶歇 |
主持人：金存忠 中国电子专用设备工业协会常务副秘书长
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Moderator:Cunzhong JIN, Executive Deputy Secretary general of China Electronic Production Equipment Industry Association
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10:30-10:50 |
国产装备进入集成电路大生产线的瓶颈与对策 |
| Bottlenecks and Countermeasures for Homemade Equipment Entering Large Production Lines of Integrated Circuit | |
| 李晋湘 中国电子专用设备工业协会副秘书长、华大半导体有限公司、上海积塔半导体有限公司董事/总工程师 | |
| Jinxiang li Association/Director of Board/Chier Engineer | |
| Executive Deputy Secretary general of China Electronic Production Equipment Industry,Huada Semiconductor Co.,Ltd | |
| GTA Semiconductor Co.,Ltd | |
10:50-11:10 |
以“先”领“芯”先导集团产业园国产装备自主之路 |
| 缺英文 | |
| 王燕清 先导集团董事长 | |
| Yanqing Wang，President of LEAD GROUP | |
11:10-11:30 |
新形势下中国半导体装备企业的定位与思考 |
| Positioning and Thinking of China's Semiconductor Equipment Company under the New Situation | |
| 王坚 盛美半导体设备（上海）股份有限公司总经理 | |
| Jian Wang Chairman of ACM Research (Shanghai),General Manager. | |
11:30-11:50 |
集成电路光学检测设备在中国的发展和挑战 |
| Development and Challenges of Integrated Circuit Optical Inspection and Metrology Equipment in China | |
| 陈鲁 深圳中科飞测科技股份有限公司董事长 | |
| CHEN LU，CEO OF Skyverse Technology Co.,Ltd | |
11:50-12:10 |
科技创新与仪器设备技术 |
| Innovation of science and technology and instrument equipment technology | |
| 褚君浩 中国科学院院士 | |
| Junhao Chu, Academician of the Chinese Academy of Sciences | |
11:50-13:00 |
自助午餐 Buffet Lunch |
主持人：李晋湘 中国电子专用设备工业协会副秘书长、华大半导体有限公司、上海积塔半导体有限公司董事/总工程师
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Jinxiang li Association/Director of Board/Chier Engineer
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Executive Deputy Secretary general of China Electronic Production Equipment Industry,Huada Semiconductor Co.,Ltd
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13:00-13:20 |
原子层沉积技术在先进半导体芯片的应用及国产化展望 |
| Application of Atomic Layer Deposition Technology in Advanced Semiconductor Chips and Prospect of Nationalization | |
| 黎微明 江苏微导纳米科技股份有限公司副董事长兼首席技术官 | |
| Weimin Li,Vice-chairman&CTO of Jiangsu Leadmicro Nano-Technology Co., Ltd. | |
13:20-13:40 |
聚焦先进前道工艺应用，提高国产光学量测和检测设备的竞争力 |
| Advance China’s Optical Metrology and Inspection Equipment Development | |
| 杨峰 睿励科学仪器（上海）有限公司总经理兼首席执行官 | |
| FENG YANG，CEO of RSIC | |
13:40-14:00 |
新时代下国产设备的发展 |
| Growth of Domestic Semiconductor Companies in the New Era | |
| 张孝勇 拓荆创益（沈阳）半导体设备有限公司 首席技术官、副总经理 | |
| Sean，vice president、CTO of Piotech,Inc | |
14:00-14:20 |
半导体设备国产替代加速 |
| Rapid developing of China semiconductor equipment | |
| 叶国光 无锡邑文电子科技有限公司副总经理 | |
| Jurgen Ye,Deputy general manager of Advanced Materials Technology & Engineering, Inc. | |
14:20-14:40 |
“芯”挑战化为新机遇 思锐智能再出发 |
| New challenges bring new opportunities,SRII further expands semiconductor equipment field | |
| 聂翔 青岛四方思锐智能技术有限公司董事长 | |
| Nie Xiang, General Manager of Qingdao Sifang SRI Intellectual Technology Co. Ltd | |
14:40-15:00 |
茶歇与展览交流 Networking Break |
15:00-15:20 |
刻蚀-沉积一体化赋能化合物半导体功率器件的大规模制造 |
| Integrated Etch & Deposition Solutions Enabling Compound Semiconductor Power Devices High Volume Manufacturing | |
| 许开东 博士 江苏鲁汶仪器股份有限公司董事长兼CEO | |
| Dr.XU Kaidong, Chairman of the Board & CEO Jiangsu Leuven Instruments Co., Ltd. | |
15:20-15:40 |
芯鑫租赁，综合金融服务资源整合者—投租结合，助力国家集成电路产业发展SINO IC LEASING, Integrator of comprehensive financial services—contributes to the development of national integrated circuit industry by using the combination of investment and financial leasing. |
| 袁以沛 芯鑫融资租赁有限责任公司联席总裁 | |
| Daniel Yuan,Co-President of Sino IC Leasing Co.,Ltd | |
15:40-16:00 |
高精度2D&3D检量测结合深度学习，为芯片良率保驾护航 |
| High Precision 2D&3D Vision Technologies with Deep Learning Ensures the Quality of Chip Packaging | |
| 郑军 博士 聚时科技（上海）有限公司 CEO Dr.JUN ZHENG,CEO of Matrixtime Robotics Co.,Ltd. | |
16:00-16:20 |
临时键合及解键合助力后摩尔时代 |
| Temporary Bonding and Debonding for More Than Moore Applications | |
| 张羽成 苏州芯睿科技有限公司 副总 | |
| Kevin Chang,General Manager of Suzhou iWISEETEC.Co.,Ltd | |
16:20-16:40 |
智算融合 筑基创新——智能计算系统解决方案赋能AIGC发展速度 |
| Integration of Intelligence and Computing Foundation Building Innovation——Intelligent Computing System Solutions Empower AIGC to Accelerate Development | |
| 赵文来 太初（无锡）电子科技有限公司首席科学家 | |
| Zhao Wenlai,Chief Scientist of Taichu (Wuxi) Electronic Technology Co., Ltd | |
16:40-17:00 |
中国半导体设备回顾与展望 |
| Review and Prospect of Semiconductor Equipment in China | |
| 金存忠 中国电子专用设备工业协会常务副秘书长 | |
| Cunzhong JIN, Executive Deputy Secretary general of China Electronic Production Equipment Industry Association | |
17:30-19:30 |
欢迎晚宴 Welcome Banquet |
| 中国电子系统工程第二建设有限公司（节目） | |
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