专题论坛
2023-08-22 作者: 晴天
| 专题一 半导体设备与核心零部件配套新进展专题论坛 | |
| Session I: New Progress of Semiconductor Equipment Core Components | |
| 时间：8月9日 09:00-17:00 地点：A6馆 Time:09:00-17:00 ,August 9th Venue: Hall A6 | |
|
赞助单位：泓浒、品宙、复享光学、爱安特、金桥、爱安特、史陶比尔、汇专集团、精量电子、通嘉宏瑞、 固高科技、科慕化学、阿米精控、鲁汶仪器、珠海诚锋电子、颇尔、中导光电、12所 |
|
| 主持人:叶乐志 博士 中国电子专用设备工业协会副秘书长 | |
| Moderator:Ye Lezhi China electronic production equipment Industry association | |
| Deputy Secretary General | |
| 时间/Time | 内容/Contents |
09:00-09:20 |
EP级超高纯管道国产化思考 |
| Reflections on the localization of UHP grade EP tube | |
| 陶然 宣城品宙洁净科技有限公司 总经理 | |
| Alex Tao，General Manager of Xuancheng PVE Cleantech Co.,LTD | |
09:20-09:40 |
国产化晶圆传送设备的机遇与挑战 |
| Opportunities and Challenges for Localized Wafer Transport Equipment | |
| 林坚 泓浒（苏州）半导体科技有限公司 创始人&执行总裁 | |
| Jacky Lin，Founder&CEO of Honghu (Suzhou) Semiconductor Technology Co.,Ltd. | |
09:40-10:00 |
终点检测在等离子体刻蚀工艺中的应用 |
| Endpoint Detection for Plasma Etching | |
| 陆祺峰 博士 上海复享光学股份有限公司市场经理 | |
| Qifeng Lu,Marketing Manager of Shanghai Ideaoptics Corp., Ltd. | |
10:00-10:20 |
高性能电连接技术助力半导体设备稳定运行 |
| High-performance electrical connection technology ensures stable operation of semiconductor equipment | |
| 杨智斌 史陶比尔（杭州）精密机械电子有限公司北方大区销售经理 | |
| Zhibin Yang, Regional Sales Manager of STAUBLI HANGZHOU LTD. | |
10:20-10:30 |
茶歇与展览交流Networking Break |
10:30-10:50 |
共筑稳健供应链体系：交付需求的系统化分析 |
| Building a robust supply chain system: The systematic analysis of delivery requirements | |
| 许孟 爱安特（常州）精密技术有限公司销售总监 | |
| Meng Xu,Sales Director of A&T(Changzhou) Precision Technology Co., Ltd | |
10:50-11:10 |
汇专超声绿色机床在半导体行业的创新应用 |
| Innovative Application of Conprofe Ultrasonic-Green Machine Tools in Semiconductor Industry | |
| 李伟 汇专科技集团股份有限公司 半导体行业销售总监 | |
| Vick.Li,Sales Director of CONPROFE TECHNOLOGY GROUP CO,LTD | |
11:10-11:30 |
传感器在高性能工业控制里的发展及应用 |
| The development and application of sensors in high-performance industrial control | |
| 郑婷婷 精量电子（深圳）有限公司传感器事业部亚太区业务拓展负责人 | |
| Irene Zheng ,TE Connectivity | |
11:30-11:50 |
聚焦干泵“芯”机遇，助力行业新发展 |
| Focus on "Chip" opportunities of dry vacuum pump to help the new development of the industry | |
| 魏民 北京通嘉宏瑞科技有限公司 副总经理 | |
| Robin Wei, Vice General Manager Beijing Grand Hitek Co., Ltd. | |
11:50-12:10 |
网络式运动控制系统在高端半导体装备中的技术与实践 |
| Technology and Practice of Networked Motion Control System in High-end Semiconductor Equipment | |
| 李泽源 固高科技股份有限公司技术副总经理 | |
| Arsen Li, CTO of Googol Technology | |
12:10-13:00 |
自助午餐 Buffet Lunch |
主持人：金存忠 中国电子专用设备工业协会常务副秘书长 |
|
Moderator:Cunzhong JIN, Executive Deputy Secretary general of China Electronic Production Equipment Industry Association |
|
13:00-13:20 |
半导体封装测试设备国产化 |
| Localization of semiconductor packaging & testing equipment | |
| 叶乐志 博士 中国电子专用设备工业协会副秘书长 | |
| Ye Lezhi,Deputy Secretary General of China electronic production equipment Industry association | |
13:20-13:40 |
Krytox™ 高性能润滑剂在半导体设备中的应用 |
| Krytox™ Performance Lubricant Application in Semicon Industry Equipment | |
| 何彦祯 科慕化学（上海）有限公司亚太区技术服务经理 | |
| Eva He，Technical Service Manager, AP of The Chemours Company | |
13:40-14:00 |
微纳测量与超精密运动伺服技术及其在集成电路装备中的应用 |
| Micro/nano measurement and ultra high precision servo technologies supporting IC manufacturing | |
| 闫鹏 阿米精控科技（山东）有限公司 执行董事 | |
| Peng Yan,Executive Director of AMI Precision Control Technology Co., Ltd. | |
14:00-14:20 |
离子束刻蚀-AR/VR领域的图形化解决方案 |
| Ion Beam Etch as a Patterning Solution in AR/VR | |
| 杨宇新 博士 江苏鲁汶仪器股份有限公司 离子束刻蚀技术经理 | |
| Dr.YANG Yuxin，IBE Etch Product Line Manager of Jiangsu Leuven Instruments Co., Ltd. | |
14:20-14:40 |
国产零部件的机遇与挑战 |
| Opportunities and challenges of domestic components | |
| 郑广文 沈阳富创精密设备股份有限公司董事长 | |
| Guangwen ZHENG, Chairman of the Board of Shenyang Fortune Precision Equipment Co., LTD | |
14:40-15:00 |
茶歇与展览交流 |
| Networking Break | |
15:00-15:20 |
过程检技术在Wafer扩膜品控的应用 |
| The Application of Process Inspection Technology in Wafer Expansion Film Quality Control | |
| 武秉文 珠海诚锋电子科技有限公司 副总经理 | |
| Bingwen Wu，Vice General Manager of Zhuhai Chengfeng Electronic Technology Co.,Ltd. | |
15:20-15:40 |
共享全球科技 助力智慧中国 ——Pall本土化在路上 |
| Sharing global technology，promoting smart China -- Pall localization underway | |
| 刘亚文 颇尔（中国）有限公司 产品经理 | |
| Evan Liu,Product Manager of Pall (China) Co., Ltd. | |
15:40-16:00 |
半导体芯片制造缺陷检测技术及设备 |
| Defect inspection technology and equipments in Semiconductor chip manufacturing | |
| 徐景瑞 中导光电设备股份有限公司 副总裁 | |
| Xu Jingrui,Vice President of Zhongdao Optoelectronic Equipment Co.,Ltd. | |
16:00-16:20 |
集成电路装备静电卡盘技术现状及发展趋势 |
| The Current Status and Development Trend of ESC Technology for Integrated Circuit Equipment | |
| 赵世柯 中国电子科技集团公司第十二研究所 功能陶瓷中心主任 | |
| Shike Zhao，Director of Functional Ceramics Center of The 12th Research Institute of China Electronics Technology Group Corporation | |
16:20-16:40 |
投资新片区 引领新发展 |
| Invest in Lingang Special Area. Guide the new development. | |
| 陈婷雯 上海金桥临港综合区投资开发有限公司副总经理 | |
| TINGWEN CHEN,VICE PRESIDENT of SHANGHAI JINQIAO LIN-GANG COMPREHENSIVE ZONE INVESTMENT&DEVELOPMENT CO.,LTD | |
16:40-17:00 |
自主知识产权与技术标准化，助力硬科技企业上市 |
|
Evaluation and Suggestions on Requirements for SSE STAR Market Listing in Intellectual Property Audit System and Technology Standardization for Companies in High-tech and Strategically Emerging Sectors |
|
| 马志勇 博士 北京超凡知识产权管理咨询有限公司副总经理 | |
| Terry Ma,VP of Chofn Intellectual Property Agency Co., Ltd | |
| 专题二：半导体人才培养暨校企对接合作论坛 | |
| Session II: Semiconductor Talent Development & University-Enterprise Cooperation and Exchange Forum | |
| 时间：8月9日 13:00-17:35 地点：A3馆 Time:13:00-17:20 ,August 9th Venue: Hall A3 | |
| 赞助单位：盛美 摩尔精英 | |
| 主持人：闫娜 复旦大学微电子学院副院长 | |
| Moderator:Na Yan,Fudan University Vice Dean of School of Microelectronics，Professor | |
| 时间/Time | 内容/Contents |
13:00-13:30 |
国家集成电路产教融合创新平台建设工作交流 |
| Experience Communication of National Integrated Circuit Industry-education Integration Innovation Platform | |
| 张玉明 西安电子科技大学微电子学院院长 | |
| Yuming Zhang,Dean of the school of microelectronics of Xidian University | |
13:30-14:00 |
产教深度融合，努力探索实践集成电路高质量工程人才培养新模式 |
| Exploration and Practice of New Training Mode on High level IC engineering talents with Integration of Industry and Education | |
| 于奇 成都电子科技大学副院长 | |
| Yu Qi，Associate Dean of University of Electronic Science and Technology of China | |
14:00-14:30 |
校企联合共建中国集成电路装备人才高地 |
| School-enterprise joint construction of China's integrated circuit equipment talent highland | |
| 王新征 盛美半导体设备（上海）股份有限公司资深公共关系总监 | |
| Xinzheng Wang,ACM Research (Shanghai), Inc.Senior Public Relationship Director | |
14:30-14:50 |
茶歇与展览交流 Networking Break |
14:50-15:20 |
加速人才培养模式改革，提升集成电路创新能力 |
| Accelerating Reform of Talent Fostering Mode, Enhancing IC Innovation Ability | |
| 耿莉 西安交通大学微电子学院教授/院长 | |
| Li Geng,Professor/Dean of School of Xi’an Jiaotong University | |
15:20-15:50 |
共建共享产教融合工程人才培养的思考与实践 |
| 时龙兴 东南大学首席教授 | |
| Longxing Shi,Professor of Southeast University | |
15:50-16:20 |
从实训云到设计云，摩尔精英一站式设计和封测平台赋能芯片创新 |
| 张竞扬 摩尔精英董事长兼CEO | |
| JY Zhang, Chairman & CEO, MooreElite | |
16:20-16:35 |
集成电路全产业链自主人才培养模式的探索与实践 |
| Exploration and Practice of Independent Talent Training Mode for the Whole Integrated Circuit Industry Chain. | |
| 陆瑛 中国半导体行业协会集成电路分会主任 | |
| Lu Ying, Director of the Integrated Circuit Branch of the China Semiconductor Industry Association | |
16:35-16:45 |
第三批人才储备基地入选单位和专家的名单要公布 |
| The list of selected units and experts for the third batch of talent reserve bases should be announced | |
16:45-17:35 |
圆桌对话 |
| 主持人Moderator:张竞扬 摩尔精英董事长兼CEO | |
| JY Zhang, Chairman & CEO, MooreElite | |
| 嘉宾Distinguished Guest: | |
| 王坚 盛美半导体设备（上海）股份有限公司总经理 | |
| Jian Wang, Chairman of ACM Research (Shanghai),General Manager. | |
| 张竞扬 摩尔精英董事长兼CEO | |
| JY Zhang, Chairman & CEO, MooreElite | |
| 张玉明 西安电子科技大学微电子学院院长 | |
| Yuming Zhang,Dean of the school of microelectronics of Xidian University | |
| 于奇 电子科技大学副院长 | |
| Yu Qi，Associate Dean of University of Electronic Science and Technology of China | |
| 耿莉 西安交通大学微电子学院教授/院长 | |
| Li Geng,Professor/Dean of School of Xi’an Jiaotong University | |
| 时龙兴 东南大学首席教授 | |
| Longxing Shi,Professor of Southeast University | |
| 专题三：新器件新工艺推动新材料新设备创新发展 | |
| New applications and new manufacture process accelerate the innovative development of new semiconductor equipments and materials | |
| 时间：8月9日 13:00-17:00 地点：A4馆 Time:13:00-17:00 ,August 9th Venue: Hall A4 | |
|
主办单位：中国电子专用设备工业协会半导体设备分会、上海集成电路行业协会、江苏省半导体行业协会、上海集成电路材料研究院、 集成电路材料创新联合体、长三角集成电路设备材料推进小组 |
|
| 主持人：冯黎 上海集成电路材料研究院副总经理、集成电路材料创新联合体秘书长 | |
| Flora Feng,Vice President of SICM & General Secretary of ICMIC | |
| 领导致辞 | |
| 时间/Time | 内容/Contents |
13:30-13:35 |
郭奕武 上海市集成电路行业协会秘书长 |
| Yiwu Guo, Secretary General of Shanghai Integrated Circuit Industry Association (SICA) | |
13:35-13:40 |
秦舒 中国半导体行业协会集成电路分会秘书长、长三角融合创新联盟轮值理事长、江苏省半导体行业协会（JSSIA）秘书长 |
|
Shu Qin, Secretary General of Integrated circuit branch of China Semiconductor Industry Association/Rotating Chairman of Yangtze River Delta Integration Innovation Alliance/ Secretary General of Jiangsu Semiconductor Industry Association (JSSIA). |
|
主题演讲 |
|
时间/Time |
内容/Contents |
13:40-14:00 |
AI for IC Materials-加速集成电路材料研发与产业化进程 |
| AI for IC Materials to accelerate semiconductor materials R&D and Industrialization | |
| 冯黎 上海集成电路材料研究院副总经理、集成电路材料创新联合体秘书长 | |
| Flora Feng,Vice President of SICM & General Secretary of ICMIC | |
14:00-14:20 |
先进MEMS传感器对集成电路设备材料的创新需求 |
| Innovation Demand to IC Equipment & Materials from Advanced MEMS Devices | |
| 王诗男 上海集成电路材料研究院首席技术专家 | |
| Shinan Wang,Chief Technologist of Shanghai Institute of IC Materials | |
14:20-14:50 |
碳化硅器件工艺发展趋势以及相应需求的核心设备 |
| Silicon carbide device process development trend and corresponding demand of core equipment | |
| 贺中鹤 积塔半导体（上海）有限公司制造技术发展与评估部部长 | |
| Crane He GTA semiconductor.co.ltd Foundry technology advance research department Manager | |
14:50-15:20 |
卓粤创芯，强链补链，高端模拟工艺技术之特色设备需求探讨 |
| Discussion on Boutique Equipments Demands for High-end Analog Technologies | |
| 赵斌 粤芯半导体技术股份有限公司市场与战略产品中心副总裁 | |
| Jeff Zhao CanSemi POSITION：Market and Strategy Product Center | |
15:20-15:40 |
构建中国的本土半导体零部件供应链 |
| Build a local semiconductor component supply chain in China | |
| 吕志鹏 拓荆创益（沈阳）半导体设备有限公司副总裁 | |
| Sean Lu，vice-president of Piotech (Shenyang) Semiconductor Equipment Co., Ltd | |
15:40-16:00 |
完整布局，深耕半导体核心零部件国产化 |
| Complete Layout, Further Escalation of Core Semiconductor Spare Parts Localization | |
| 边逸军 宁波江丰电子材料股份有限公司副总经理 | |
| Allen Bian,Vice President of Konfoong Materials International Co., Ltd | |
16:00-16:10 |
合影留念 |
16:10-18:00 |
上下游对接会（邀请制） |
|
主持人：毛彩虹 上海集成电路行业协会副秘书长/长三角设备材料推进小组联合发起人 |
|
|
Caihong Mao, Deputy Secretary General of Shanghai Integrated Circuit Industry Association/Founder of Yangtze River Delta IC Equipments and Materials Propulsion Group (EMG) |
|
|
【需求方发言】 中芯国际、华润微、粤芯、江苏长电、拓荆等 |
|
|
【材料和消耗品企业发言】 【设备零部件企业发言】 |
|
| 专题四：制造工艺与半导体设备产业链联动发展论坛 | |
| Session IV: Manufacturing Process and Semiconductor Equipment Industry Chain Linkage Development Forum | |
| 时间：8月10日 09:00-17:00 地点：A1馆 Time:09:00-17:00 ,August 10th Venue: Hall A1 | |
|
赞助单位：微导纳米、思锐智能、拓荆科技、飞潮、合肥芯碁、东方晶源、魏德米勒、苏州芯默、中电二、 寄云科技、青岛天仁微、芯梦、华芯智能、中电环境、浙江科赛、成川科技、苏州天准、智造家 |
|
| 主持人：江苏半导体行业协会副秘书长阮秘书长 阮舒拉 | |
|
Ren Zhou,CEO of Jiangsu Leadmicro Nano-Technology Co.,Ltd. |
|
| 时间/Time | 内容/Contents |
09:00-09:20 |
“芯机遇”新布局-思锐智能进一步开拓半导体装备领域 |
|
SRII further expands semiconductor equipment field |
|
| 陈祥龙 青岛四方思锐智能技术有限公司副总经理 | |
| Chen Xiang Long，Vice President of Qingdao Sifang SRI Intellectual Technology Co. Ltd | |
09:20-09:40 |
赋能技术延伸的原子层沉积和晶圆键合设备的开发 |
| ALD and Bonding Equipment Development for Technology Extension | |
| 陈新益 拓荆创益（沈阳）半导体设备有限公司副总经理 | |
| Andy Cben，vice president of Piotech, Inc. | |
09:40-10:00 |
顺势而为，过滤设备的国产化进程 |
| Ride the wave，localization process of filtration equipment | |
| 李楹轩 飞潮（上海）新材料股份有限公司应用技术主管 | |
| Yingxuan Li,Application Manager of Feature-Tec(shanghai)Advanced Materials Co.,Ltd. | |
10:00-10:20 |
原子层沉积技术在半导体中的应用 |
| Application of Atomic Layer Deposition Technology in Semiconductor | |
| 聂佳相 江苏微导纳米科技股份有限公司 半导体事业部资深销售总监 | |
| Jiaxiang Nie，Semiconductor Division Senior Sales Director of Jiangsu Leadmicro Nano-Technology Co., Ltd. | |
10:20-10:30 |
茶歇与展览交流Networking Break |
10:30-10:50 |
用于集成电路良率监控的电子束检测量测设备的国产化之路 |
| Localization of Electron Beam Inspection/Metrology Tools for IC Yield Monitoring | |
| 孙伟强 东方晶源微电子科技（北京）股份有限公司创新技术研究院院长 | |
| Weiqiang Sun, Director of Advanced Research Center of Dongfang Jingyuan Electron Co..,Ltd. | |
10:50-11:10 |
直写光刻在高性能封装中的应用 |
| Application of Direct Lithography in High Performance Packaging | |
| 曲鲁杰 合肥芯碁微电子装备股份有限公司首席科学家&副总经理 | |
| LujieQv,Chief Scientist/VP of Circuit Fabology Microelectronics Equipment Co., Ltd. (CFMEE) | |
11:10-11:30 |
晶圆级多点控温式热处理成套设备 |
| Multi-loop based rapid thermal process control for wafer level equipment | |
| 赖政志 苏州芯默科技有限公司副董事长 | |
| Simon Lai,deputy chairman of Suzhou Semithermal Technology Co.,Ltd | |
11:30-11:50 |
全球化、数字化—魏德米勒助力中国半导体智能制造新飞跃 |
| 施剑金 魏德米勒电联接（上海）有限公司 江苏大区销售经理 | |
| James Shi，Assistant Sales Account Manager-Jiangsu of | |
| Weidmüller Interface (Shanghai) Co., Ltd. | |
11:50-13:00 |
自助午餐 Buffet Lunch |
主持人：于大洋 北京诺华资本投资管理有限公司总经理 |
|
Host: Alex Yu, General Manager of Beijing Nuo Capital Investment Management Co., Ltd. |
|
13:00-13:20 |
先进半导体洁净厂房的精益设计研讨 |
|
Discussion on Lean Design of Advanced Semiconductor Clean Workshop |
|
| 陆晶 中国电子系统工程第二建设有限公司设计总院常务副院长 | |
|
Lu Jing，Vice Presidentof China Electronic Systems Engineering No.2 Construction Co.,LTD |
|
13:20-13:40 |
从装备智能化到生产智能化 |
| From equipment intelligence to production intelligence. | |
| 柯晗 北京寄云鼎城科技有限公司COO | |
| KE HAN,COO of NeuCloud | |
13:40-14:00 |
纳米压印光刻：AR衍射光波导生产解决方案 |
| Nanoimprint Total Solution for AR waveguide production | |
| 冀然 青岛天仁微纳科技有限责任公司董事长 | |
| DR.JI RAN，CEO of Qingdao Germanlitho Co., Ltd. | |
14:00-14:20 |
创新引领，共同助力芯发展 |
| Leading with Innovation, Collaborating for Chip Development | |
| 廖周芳 江苏芯梦半导体设备有限公司首席执行官 | |
| Steve.Liao,CEO of Jiangsu Xin Meng Semiconductor Equipment Co.,Ltd. | |
14:20-14:40 |
AMHS的挑战与演进 |
| AMHS Challenge and Evolution | |
| 蔡志贤 华芯（嘉兴）智能装备有限公司 董事兼副总经理 | |
| Alec Tsai, Vice President of HuaXin(JiaXing) Intelligent Manufacturing Co., LTD | |
14:40-15:00 |
茶歇与展览交流Networking Break |
15:00-15:20 |
超纯水水质标准与半导体制程相关性探讨 |
| Discussion on the correlation between Ultra Pure Water quality standard and semiconductor process | |
| 李晓波 江苏中电创新环境科技有限公司 设计院副院长 | |
| XIAOBO LI, Technical Service Manager, AP China Electronics Innovation Environmental Technology Co.,LTD | |
15:20-15:40 |
含氟工程塑料应用及探索 |
| Application and exploration of fluorine-containing engineering plastics | |
| 徐金戈 浙江科赛新材料科技有限公司 项目经理 | |
| JackyXu，Sales Manager of Zhejiang Conceptfe New Material Technology Co.,Ltd | |
15:40-16:00 |
半导体全自动化生产线构筑解决方案 |
| The solutions of semiconductor full-automatic production line | |
| 肖永刚 成川科技（苏州)有限公司 副总经理 | |
| Simon Xiao，Vice President of Linkwise Technology （Suzhou） Co., Ltd | |
16:00-16:20 |
半导体国产光学量测检测设备的应用与挑战 |
| Application and challenges of semiconductor domestic optical measurement and inspection equipment | |
| 阎海滨 苏州天准科技股份有限公司副总经理 | |
| Coast Yan,VP of Tztek | |
16:20-16:40 |
数智变革，非标制造应用落地新趋势 |
| Digital Intelligence Transformation, New Trends in the Implementation of Non Standard Manufacturing Applications | |
| 刘晓亮 广州智造家网络科技有限公司 首席营销官 | |
| Kevin Liu , Chief Marketing Officer of IMEFuture | |
16:40-17:00 |
浅谈光罩生产相关设备国产化 |
| Introduction to Mask Manufacturing Equipment And Localization overview | |
| 王兴平 宁波冠石半导体有限公司总经理 | |
| Mark Wang,General Manager of Ningbo Keystone Semiconductor Co.Ltd. | |
| 专题五 化合物装备与材料专题论坛 | |
| Session V: Compound Equipment and Material Development Forum | |
| 时间：8月10日 09:20-12:00 地点：A3馆 Time:09:20-12:00 ,August 10th Venue: Hall A3 | |
| 赞助单位：北方华创、盛美、中微、邑文、中科院光电所、熹贾精密、惠然科技 | |
| 主持人： 周贞宏 博士 CEO of BelGaN BV | |
| Alan Zhou， Ph.D. CEO of BelGaN BV | |
| 时间/Time | 内容/Contents |
09:00-09:20 |
面向化合物半导体的装备与工艺解决方案 |
| NAURA equipment and process solutions for compound semiconductors | |
| 张轶铭 博士 北京北方华创微电子装备有限公司产品与解决方案经理 | |
| Dr. Yiming Zhang，R&D Manager of NAURA Technology Group Co., Ltd | |
09:20-09:40 |
新能源与元宇宙的国产半导体设备进展 |
| The progress of China semiconductor equipment development in new energy and metaverse application. | |
| 叶国光 无锡邑文电子科技有限公司副总经理 | |
| Jurgen Ye,Deputy general manager of Advanced Materials Technology & Engineering, Inc. | |
09:40-10:00 |
从LED照明到功率器件应用，中微设备助力化合物半导体产业高速发展 |
| AMEC Platform for Advancing GaN and SiC Solutions From LED Lighting to Power Device Applications | |
| 陈耀 博士 中微半导体设备（上海）股份有限公司工艺技术总监 | |
| Yao Chen，Director of Process Technology of AMEC | |
10:00-10:20 |
第三代半导体电镀挑战和进展 |
| Challenges and progress of the compound semiconductor electroplating | |
| 吴勐 盛美半导体设备（上海）股份有限公司资深工艺总监 | |
| Meng wu,Senior Process Director of ACM Research (Shanghai), Inc. | |
10:20-10:40 |
茶歇与展览交流 Networking Break |
10:40-11:00 |
特种芯片光刻技术与装备 |
| The lithographic equipment applied in specific chips | |
| 王建 中国科学院光电技术研究所研究员 | |
| Wang Jian，Researche of Institute of Optics and Electronics, Chinese Academy of Sciences | |
11:00-11:20 |
风雅颂之 “风”6000——适用广泛的泛半导体电子显微镜 |
| Highly adaptable scanning electron microscope for semicon industry | |
| 杨润潇 惠然科技有限公司副总工程师 | |
| Rick Young，Vice-Chief Engineer of WellRun Technology Co.,Ltd | |
11:20-11:40 |
半导体密封件技术演变和国产化进程 |
| Technology Evolution of Semiconductor Seals and Localization Process | |
| 叶寅 上海熹贾精密技术有限公司总经理 | |
| Tiger Ye，General manager of Shanghai Sieg Technology Co., Ltd | |
11:40-12:00 |
化合物半导体设备和材料产业机遇—立足中国面向欧洲 |
| Opportunities for the Compound Semiconductor Equipment and Materials Industry—Base in China and Targeting Europe | |
| 周贞宏 博士 CEO of BelGaN BV | |
| Alan Zhou， Ph.D. CEO of BelGaN BV | |
12:00-13:00 |
自助午餐 Buffet Lunch |
| 专题六 2023半导体制造技术与设备材料董事长论坛 | |
| Session VI: Chairman's Forum on Semiconductor Manufacturing Technology and Equipment Materials | |
| 时间：8月10日 13:00-17:10 地点：A3馆 Time:13:00-17:10 ,August 10th Venue: Hall A3 | |
| 主持人：杨绍辉 光大证券研究所首席分析师 | |
| Shaohui Yang, Chief Analyst of Everbright Securities Co.,Ltd. | |
| 时间/Time | 内容/Contents |
13:00-13:10 |
领导致辞 中国电子专用设备工业协会常务副秘书长金存忠 顾国栋 无锡高新区党工委委员、管委会副主任、新吴区委常委、副区长、太科园党工委书记 |
| 13:10-13:20 |
颁发董事长论坛纪念奖杯 |
13:20-13:35 |
中国半导体设备现状与发展机遇 |
| Current situation and development opportunities of semiconductor equipment in China | |
| 杨绍辉 光大证券研究所首席分析师 | |
| Shaohui Yang, Chief Analyst of Everbright Securities Co.,Ltd. | |
13:35-13:55 |
底层创新实现半导体设备竞争力的突破 |
| WFE Competitiveness Breakthrough with Fundamental Innovation | |
| 洪峰 深圳市埃芯半导体科技有限公司总经理 | |
| Hong Feng ，CEO of Shenzhen Angstrom Excellence Technology Co., Ltd | |
13:55-14:15 |
先进陶瓷材料在半导体装备中的应用 |
| Application of advanced ceramic materials in semiconductor equipments | |
| 刘先兵 苏州珂玛材料科技股份有限公司董事长兼总经理 | |
| Xianbing Liu,President&CEO of Suzhou Kematek,Inc. | |
14:15-15:25 |
圆桌论坛A |
| 圆桌嘉宾： | |
| 尹志尧 博士 中微半导体设备(上海）股份有限公司董事长兼总经理 | |
| GERALD YIN , CHAIRMAN&CEO of AMEC | |
| 吕光泉 拓荆科技股份有限公司董事长 | |
|
Guangquan Lv, Chairman of Piotech (Shenyang) Semiconductor Equipment Co., Ltd |
|
| 王燕清 先导控股集团有限公司/无锡先导集团 董事长 | |
|
Yanqing Wang,Chairman of LEAD GROUP |
|
| 郑广文 沈阳富创精密设备股份有限公司董事长 | |
| Guangwen ZHENG，Chairman of the Board of Shenyang Fortune Precision Equipment Co., LTD | |
| 俞宗强 博士 东方晶源微电子科技（北京）股份有限公司董事长兼首席技术官 | |
| Zongchang Yu, Chairman and CTO of Dongfang Jingyuan Electron Co.,Ltd. | |
| 刘先兵 苏州珂玛材料科技股份有限公司董事长兼总经理 | |
| Xianbing Liu,President&CEO of Suzhou Kematek,Inc. | |
| 李勇军 上海凯世通半导体股份有限公司董事长 | |
| CEO of Kingsotne Semiconductor Joint Stock Company Limited | |
| 洪 峰 深圳市埃芯半导体科技有限公司总经理 | |
| Hong Feng ，CEO of Shenzhen Angstrom Excellence Technology Co., Ltd | |
15:25-15:45 |
后摩尔时代的挑战及人工智能的机遇——芯片制造从艺术到科学到智能 |
| Challenges in the Post-Moore Era and Opportunities in AI——Makes IC making from Art to Science and Intelligent | |
| 俞宗强 博士 东方晶源微电子科技（北京）股份有限公司董事长兼首席技术官 | |
| Zongchang Yu, Chairman and CTO of Dongfang Jingyuan Electron Co.,Ltd. | |
15:45-16:05 |
高效电性监控方案保障高质量集成电路量产 |
| Advanced Parametric Monitoring Solutions For High Quality IC Manufacturing | |
| 郑勇军 杭州广立微电子股份有限公司董事长 | |
| Yongjun Zheng,Chairman of Semitronix Corporation | |
16:05-17:05 |
圆桌论坛B |
| 王 晖 盛美半导体设备（上海）股份有限公司董事长 | |
| David Wang,Chairman of ACM Research (Shanghai), Inc. | |
| 宗润福 沈阳芯源微电子设备股份有限公司董事长 | |
| Ford Zong,Chairman & CEO of KINGSEMI CO.,LTD. | |
| 程 卓 合肥芯碁微电子装备股份有限公司董事长 | |
| ZHUO CHENG,Chairman of Circuit Fabology Microelectronics Equipment Co., Ltd. | |
| 郑勇军 杭州广立微电子股份有限公司董事长 | |
| Yongjun Zheng, Chairman of Semitronix Corporation | |
| 曾 安 南京中安半导体设备有限责任公司 | |
| An Zeng,Nanjing ZhongAn Semiconductor Equipment Ltd | |
| 宋维聪 上海陛通半导体能源科技股份有限公司董事长兼CEO | |
| Waley Sung，Chairman of BETONE TECHNOLOGY SHANGHAI,INC | |
| 林 坚 泓浒（苏州）半导体科技有限公司执行总裁兼首席技术官 | |
| Jacky Lin, CEO&CTO of HongHu(Suzhou)Semiconductor Technology Co., Ltd | |
17:05-17:10 |
合影留念 |
| 专题七 二手设备产业交流合作论坛 | |
| Session VII: Second-hand Equipment Industry Exchange and Cooperation Forum | |
| 时间：8月11日 09:00-12:00 地点：A3 | |
| Time:09:00-12:00 ,August 11th Venue: Hall A3 | |
| 赞助单位：芯鑫租赁 | |
| 主持人：王作义 广奕科技董事长 | |
| Zuoyi Wang,Chairman,Shanghai Vastity Electronics Techology Co.,Ltd. | |
| 时间/Time | 内容/Contents |
09:00-09:20 |
二手半导体制造设备在供应链中的定位与作用 |
| The position and role of used semiconductor manufacturing equipment in the supply chain | |
| 陈真 盈球半导体科技有限公司中国区总经理 | |
| Jingle Chen, China General Manager of SurplusGLOBAL,Inc | |
09:20-09:40 |
半导体二手设备企业的挑战及机遇 |
| Challenges and opportunities for semiconductor used equipment enterprises | |
| 杨伟才 三井住友金融与租赁株式会社中国总代理/上海健照半导体科技有限公司总经理 | |
| WEICAI YANG, General agent in China，Sumitomo Mitsui Finance and Leasing Co.,Ltd/CEO of Shanghai JoinWide Semiconductor Technology Co., Ltd. | |
09:40-10:00 |
二手光刻机在半导体国产化大潮中的挑战和机会 |
| The challenges and opportunities of used lithography machine in the tide of semiconductor localization | |
| 姚庆利 上海赛瑾精密科技有限公司 总经理 | |
| Alex Yao，Shanghai Saijin Precision Technology Co., LTD General Manger | |
10:00-10:20 |
聚焦集成电路设备融资 助力国内二手设备/新设备厂商发展 |
| Specializing in semi-equipment financing, promoting the growth of domestic equipment makers | |
| 闫 波 芯鑫融资租赁有限责任公司 集成电路及半导体部 总经理 | |
| Yan Bo , SINO IC LEASING CO., LTD Integrated Circuit And Semiconductor Department General Manager | |
10:20-10:30 |
茶歇与展览交流 Networking Break |
10:30-10:50 |
半导体设备企业如何借助资本市场快速发展 |
| How semiconductor equipment companies can develop rapidly with the help of the capital market | |
| 张银 上股交金融服务中心总经理 | |
| Yin Zhang,general manager of Shanghai SETC Financial Service Company Limited | |
10:50-11:10 |
中国芯片制造设备的现状及历史机遇 |
| The status and historical opportunity of China chip manufacturing equipment | |
| 王作义 上海广奕电子科技股份有限公司董事长 | |
| Zuoyi Wang,Chairman,Shanghai Vastity Electronics Techology Co.,Ltd. | |
11:10-12:10 |
圆桌对话： |
| 主持人：王作义 上海广奕电子科技股份有限公司董事长 | |
| Zuoyi Wang,Chairman,Shanghai Vastity Electronics Techology Co.,Ltd. | |
| 圆桌嘉宾： | |
| 陈 真 盈球半导体科技有限公司中国区总经理 | |
| Jingle Chen,China General of Manager of SurplusGLOBAL,Inc | |
| 杨伟才 三井住友金融与租赁株式会社中国总代理/上海健照半导体科技有限公司 总经理 | |
| WEICAI YANG, General agent in China，Sumitomo Mitsui Finance and Leasing Co.,Ltd;CEO of Shanghai JoinWide Semiconductor Technology Co., Ltd. | |
| 姚庆利 上海赛瑾精密科技有限公司总经理 | |
| Alex Yao，Shanghai Saijin Precision Technology Co., LTD General Manger | |
| 孙海兵 吉姆西半导体科技（无锡）有限公司副总经理 | |
| Sun HaiBing，GMC，Vice General Manager | |
| 符友银 新毅东（上海）科技有限公司副总经理 | |
| Fu YouYin，BNE，Deputy General Manager | |
12:10-13:00 |
自助午餐 Buffet Lunch |
| 专题八 半导体设备与核心零部件产业投资论坛 | |
| Session VIII: Semiconductor Equipment and Core Components Industry Investment Forum | |
| 时间：8月11日 09:00-12:00 地点：A1馆 Time:09:00-12:00 ,August 11th Venue: Hall A1 | |
| 赞助单位：兴业证券、中信银行 | |
| 主持人：季宗亮 季华资本创始人 | |
| Zongliang Ji, Founder of Jihua Capital | |
| 时间/Time | 内容/Contents |
09:00-09:20 |
一代材料，一代设备，一代工艺，建设国产自主可控的生态圈 |
| Creating an autonomous and controllable domestic ecosystem with generations of materials, equipment and processes | |
| 印琼玲 新阳硅密（上海）半导体技术有限公司副董事长 | |
| Jolin Yin,Vice Chairman of SYSTECH TECHNOLOGY CO.，LIMITED | |
09:20-09:40 |
外忧内卷下半导体零部件国产化道路 |
| The road to localization of semiconductor parts in the face of external concerns and internal competition | |
| 司奇峰 芜湖通潮精密机械股份有限公司董事长 | |
| Herry，Chairman of Tong chao Precision Machinery Co.,Ltd | |
09:40-10:00 |
半导体高端密封圈和真空阀件的解决方案 |
| Solutions for semiconductor high-end seals and vacuum valves | |
| 丁晓荣 温州邦欣源科技有限公司董事长 | |
| Dr.XR DING,President of Wenzhou Bangxinyuan Semiconductor Technology Co., Ltd | |
10:00-10:20 |
半导体企业与资本市场的协同发展 |
| How to develop with capital market | |
| 王怡人 兴业证券股份有限公司董事总经理 | |
| Wang Yi Ren,MD of China Industrial Securities Co.LTD | |
10:20-10:40 |
第三代半导体检测量测设备的机会和挑战 |
| Opportunity and Challenge of Inspection and Measurement Equipment for the Third Generation Semiconductor | |
| 唐德明 上海优睿谱半导体设备有限公司总经理 | |
| Deming Tang，CEO of Avant Semiconductor Equipment Co. LTD | |
10:40-10:50 |
茶歇与展览交流 Networking Break |
10:50-12:00 |
头脑风暴 |
| 主持人： | |
| 季宗亮 季华资本创始合伙人 | |
| Zongliang Ji, Founder of Jihua Capital | |
| 嘉宾： | |
| 牛俊岭 元禾璞华（苏州）投资管理有限公司董事总经理 | |
| JUNLING NIU,Managing Director of Hua Capital | |
| 姜寅明 浑璞投资合伙人 | |
| Yinming Jiang, | |
| 李昌哲 托伦斯半导体设备（启东）有限公司副总经理 | |
| Changzhe Li, vice president of Tolerance Semiconductor Equipment Qidong Co., Ltd. | |
| 司奇峰 芜湖通潮精密机械股份有限公司董事长 | |
| Herry，Chairman of Tong chao Precision Machinery Co.,Ltd | |
| 印琼玲 新阳硅密（上海）半导体技术有限公司副董事长 | |
| Jolin Yin,Vice Chairman of SYSTECH TECHNOLOGY CO.，LIMITED | |
| 王琳 上海超越摩尔私募基金管理有限公司投资管理部执行总经理 | |
| MTM Fund | |
微信扫一扫,一键转发
